דרישות:
3 – 15 Years of experience in Electronic-Mechanical packaging design for telecommunication systems.
Knowledge with 3D software for mechanical design (Inventor/SolidWorks/Etc.) – Must.
Knowledge with some of the following various production technologies:
• Sheet metal.
• Metal die casting.
• Machining (Milling).
• Extrusion.
• Plastic injection molding.
• PCB design.
Producing of manufacturing documentation (Drawing, Specs).
Computers & software: Agile (Advantage), Office (Must).
B.Sc. – Mechanical Eng.
קו"ח רלוונטיים ניתן לשלוח ל: [email protected]